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IT3 Thermal Cycling Test
TR0636E-10026
IT3 Thermal Cycling Test Report (Solder type: Sn63 Pb37)
Approved. TY. ARAI June/23rd/2008 Checked . TM. MATSUO June/23rd /2008 Prepared. TY. TAKADA June/23rd /2008
Hirose Electric Co., Ltd.
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IT3 Thermal Cycling Test
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CONTENTS
1 OVERVIEW .................................................................................................................................3 2 TEST OBJECTIVES.......................................................................................................................3 3 THERMAL CYCLING TEST PROCEDURE ..........................................................................................4 4 TEST VEHICLES ..........................................................................................................................5 4.1 Connector Type...................................................................................................................5 4.2 Test Vehicle Configuration ...................................................................................................5 4.3 Virgin or Reworked..............................................................................................................9 4.4 Test Variations ...................................................................................................................9 4.5 Number of Test Vehicles and Connectors ............................................................................9 5 ASSEMBLY CONDITIONS .............................................................................................................10 5.1 Test Board Design Detail ...................................................................................................10 5.2 Test Vehicle Assembly.......................................................................................................12 5.3 Rework .............................................................................................................................13 5.4 X-ray Inspection ................................................................................................................14 5.5 Continuity Check...............................................................................................................15 6 THERMAL CYCLING TEST PROCESS.............................................................................................16 6.1 Preconditioning by Isothermal Aging..................................................................................16 6.2 Thermal Cycle Temperature Profile Requirement ..............................................................16 6.3 Thermal Cycling Test Execution.........................................................................................17 6.4 Measurement....................................................................................................................18 6.5 Failure Criteria ..................................................................................................................18 6.6 Identifying for Failure Connector(s) and Failure Point(s) ....................................................18 6.7 Rerouting with Jumper Wire ..............................................................................................18 6.8 Test Duration.....................................................................................................................18 6.9 Test Result ........................................................................................................................19 7 SOLDER BALL SHEAR TEST ........................................................................................................20 7.1 Measurement Method ......................................................................................................20 7.2 Failure Mode.....................................................................................................................20 7.3 Test Result ........................................................................................................................20 8 REVISION RECORD....................................................................................................................21 9 Attachment _1 : 10 Attachment _2 : 11 Attachment _3: 07-29834-R1 Thermal Cycling Test Report (Trace Laboratories,Inc.) TR0636E-20027 BGA SHEARING TEST REPORT TR0636E-20033 CROSS SECTIONING REPORT
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1 OVERVIEW The following test report is to be considered official documentation for results found during thermal cycle testing of the IT3 series BGA connector system. BGA connection is becoming a key technology for current and next generation high-speed transmission. It is crucial to perform accelerated life time testing to both simulate actual applications and prove BGA attachment reliability. All processes described herein, including test board design and thermal cycling test conditions, are based on and conform to IPC-9701.
All assembly and re-work processes were performed by Jabil Circuit, Inc. (San Jose, Ca., hereafter `Jabil'), and thermal cycling was performed by Trace Laboratories, Inc.(Chicago, Il.). This document includes all processes and test procedures followed, along with who and where they were performed.
2 TEST OBJECTIVES The test samples and processes were prepared to simulate various applications that included: Both virgin and rework assemblies, connector configurations, and both single and multiple connector mounts.
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3 THERMAL CYCLING TEST PROCEDURE
Virgin assembly (5.2) Test samples (4.5) Eutectic
X-ray inspection (5.4) Continuity check (5.5) Rework (5.3)
Jabil
Test samples (4.5) Eutectic
X-ray inspection (5.4) Continuity check (5.5) Two combinations of assembled test samples [1 virgin, 1 reworked]
Thermal cycling test (6) Thermal cycling test start (6.3)
Monitor the resistance increase to initial resistance (6.4)
20 % or more increase to the initial resistance is detected for five consecutive reading scans (6.5)
Yes (Failure): Five consecutive reading scans or more
Trace Labs
No (Pass)
Suspend thermal cycling test. Detect failure points. (6.6) Rerouting to skip the failure points with jumper wire (6.7) Resume Test
Thermal Cycling Test Report (9)
NO (Failure): More than 50 % of all solder joints Failure points =< 50% (6.5) YES (Pass) Test duration (6.8) 3500 cycles Terminate test
Hirose & Jabil
Cross Section at BGA joints Jabil
Solder ball sheer test (7) Hirose
Solder Ball Sheer Test Report (10) Cross Sectioning Report (11)
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4 TEST VEHICLES The following parameters were applied to simulate various manufacturing and connector usage situations.
4.1 Connector Type Mezzanine Connector: Hirose IT3 series
Receptacle IT3M-300S-BGA(57)...Mounted on Mother Board Receptacle
IT3D-300S-BGA(57)...Mounted on Daughter Card Interposer Assembly Interposer assembly IT3-300P-17H(03)...17 mm Stacking Height
IT3-300P-32H(03)...32 mm Stacking Height
IT3 Connector
4.2 Test Vehicle Configuration Boards were designed to a thickness of 3.3 mm (125 mils) per IPC-9701
4.2.1 Multiple Connector Mount In many applications, multiple connectors are mounted on one daughter card which can create potential alignment issues and different stresses on solder joints. This test covers multiple connector mounting in various configurations.
Config. 1 Numbers of connectors / Daughter card Remarks 1 Individual
Config. 2 2 X Direction(2 CN)
Config. 3 2 Y Direction(2CN)
Config. 4 4 Quad(4 CN)
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4.2.2 Test Board Examples IT3 mezzanine connectors were assembled to the board and tested . Each test board has four IT3 connectors
300 mm
IT3M-300S-BGA (57)
300 mm
Mother Board
300 mm
IT3D-300S-BGA (57)
300 mm
Daughter Cardy Config.4y
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4.2.3
Test Board Configurations
Config. 1 ---One connector per daughter card
Spacer Position
Config. 2 ---Two connectors per daughter card (X direction)
Spacer Position
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Config. 3 ---Two connectors per daughter card (Y direction)
Spacer Position
Config. 4 --- Four connectors per daughter card
Spacer Position
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4.3 Virgin or Reworked To simulate the actual assembly process, both "Virgin" and "Reworked" board samples were tested. Assembly was done by Jabil, using industry standard assembly /rework equipment and processes.
Virgin Test Board Connector Virgin Virgin
Reworked Reuse after connector removal Virgin
4.4 Type of Solder
Virgin Solder Ball on Connector Solder Paste Eutectic Eutectic
Reworked Eutectic Eutectic
4.5 Number of Test Vehicles and Connectors
For 3.3mm (125 mil) thick test boards, the following number of connectors were used. Height IT3-300S Totals 17H 32H Config 1 6/2 6/2 12/4 Config 2 6/2 6/2 12/4 Config 3 6/2 6/2 12/4 Config 4 6/2 6/2 12/4 Total # of Connectors 24/8 24/8 48/16
Note: 12/4 represents 12 Virgin and 4 Reworked
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5 ASSEMBLY CONDITIONS 5.1 Test Board Design Detail
Test Board Design Details per IPC-9701 Item 1 2 3 4 5 Thickness # of Metal Layers Layer Structure PCB Material Ground Layer Requirement 3.3mm (125 mils) per IPC-9701 16 layers See Fig. 1 on the next page High Tg FR-4 Remaining 70% copper mesh Remarks y y y IS-410/NP-150TL Ground plane on even # layers
6 7
Signal Layer Daisy Chain
Remaining 30% copper weave On top layer only
Signal traces on odd # layers
y For failure analysis purposes, pads are connected by jumper cable to continue rest of the cycles if any failure is found. Simulate mechanical strength of actual PCBs with vias. Passed
8
Pad and Via
Pads for probing on the bottom layer through via
9
Surface Finish
High Tg OSP (Organic solderability preservative)
IPC-S-804B solderability test IPC-TM-650 insulation resistance test IPC-6012(0.75%) warp and twist test
10
Pad Type Copper Thickness
NSMD (Non-solder mask defined) Outer layer: 35 microns
y
11
Inner ground: 35 microns Inner signal: 18 microns
y
12 13
Trace Width # of Connectors
200 microns (8 mils) 10 connectors per board maximum
150 microns (6 mils) minimum (IPC-9701) y
Note: Test boards were designed to measure electrical continuity using the daisy chain circuit only. Vias were not connected to any specific signal or ground layers. Neither ground contacts nor ground layers are connected anywhere.
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Top layer (daisy chained)
Ground (meshed. 70% copper)
Signal (weaved 30% copper)
Layer Top 2nd 3rd 4th 5th 6th 7th 8th 9th 10th 11th 12th 13th 14th 15th Bottom
Footprint type Daisy chain Ground layer Signal layer Type A Ground layer Signal layer Type B Ground layer Signal layer Type A Ground layer Signal layer Type B Ground layer Signal layer Type A Ground layer Signal layer Type B Ground layer Signal layer Type A Via test points
Bottom layer (Probing pads for failure analysis and jumper cable)
* 16 Layers in Total
Fig. 1
PCB Layer Structure
IT3* - 300S-BGA Foot Pattern
270- AE0. 65+/ - 0. 05 ( Sol der M ask)
Fig. 2
BGA Land Design
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5.2 Test Vehicle Assembly Hirose provided assembly/rework process information, that was then adapted by Jabil to conform to industry standard practices. All connectors were assembled / reworked at Jabil.
5.2.1 Virgin Assembly Parameters Process parameters followed for testing.
Items Type of Reflow Equipment Pre Conditioning
Requirements Mass-reflow conveyor furnaces Dry package Thickness = 0.127 mm (0.005'')
Stencil
Frame size X= 736.6 mm, Y= 736.6 mm (29'' x 29'') Open area ratio : 90% aperture size by area Sn63 : Pb37 Sn63 : Pb37 (Kester EP 256 no-clean Eutectic solder paste) DEK-265GSX Automatic screen printer
Solder Ball Composition Solder Paste Composition (Supplier Part Number)
Process Parameters
Printing speed = 1''/second Stencil snap off = 0
Reflow Temperature Profile Reflow Atmosphere
See details on the next page. Nitrogen
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5.3 Rework "Rework" consists of a series of processes, such as removal of connector by using rework equipment (i.e., SRT), PCB cleaning and placement/reflow of a new connector using rework equipment.
5.3.1 Rework Parameters Items Type of Reflow Equipment Stencil Solder Ball Composition Solder PasteComposition Rework Atomosphere Hot air rework station Thickness = 0.127 mm (0.005'') Open area ratio : 90% aperture size by area Sn63 : Pb37 Sn63 : Pb37 (Kester EP 256 no-clean Eutectic solder paste) Nitrogen Requirements
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5.4 X-ray Inspection Test Board Design Detail X-ray inspection after assembly was conducted. All connectors passed the X-ray inspection before thermal cycling.
X ray Photo : IT3D-300S-BGA (57)
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5.5 Continuity Check Final assembly, including mounting interposer assembly / daughter cards and board spacers, was performed to complete the daisy-chain circuit prior to performing the continuity check.
R
A
A
Cross section _ AA
Resistance Per Connector Chain IT3 Interposer Height 17 mm height 32 mm height Resistance 25 to 29 38 to 42 Unit : Ohm * Resistance includes one connector assembly plus PCB trace.
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6 THERMAL CYCLING TEST PROCESS Thermal cycling test performed conforms to IPC-9701 (JESD22-A-104-B). 6.1 Preconditioning by Isothermal Aging Test specimens were subjected to an accelerated thermal aging (e.g. 24 hours at 100 C (-0/+5 C)) in air to simulate a reasonable use period and to accelerate such possible processes as solder gain, growth, intermetallic compound growth or oxidation. Test specimens were stored at room temperature following the artificial aging process and before commencing the thermal cycling test. 6.2 Thermal Cycle Chamber Profile Dummy boards and connectors were employed to simulate expected thermal mass A minimum of 4 thermal couples near connectors on at least 2 boards Thermal cycle profile Tmax = 100 oC (+10 / 0 Tmin = 0 oC ( 0 / -10 oC) Ramp rate = Approximately 10 C/min (10% to 90% of test temperature range) Dwell time = 5 to 10 min (Holding time of maximum and minimum temperature) 5 successful cycles were performed before commencing test.
o o
C)
w/Tolerance
100
Ts (max) Upper Dwell Time
Nominal Ts (max)
Temperature ( C)
Ts
T Cyclic Range
0
Ts (min)
Lower Dwell Time Nominal Ts (min) w/Tolerance Cycle Time
Time
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6.3 Thermal Cycling Test Execution
TC5
TC2
TC1 --- AIR
TC6
TC3
Door
TC4
IT3-assembled test board (Refer to 4.2.2 Test board example for test board details.)
Thermocouple Locations
Air temperature (Blue Line)
Air temperature (Yellow Line)
Chamber_1 TL 544
Chamber_2 TL 745
Measured Thermal Cycle Profile
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6.4 Measurement Chamber temperature profile was continuously monitored and recorded during the test. Electrical resistance was monitored and recorded continuously. Maximum scan interval of all chains was one minute during test. 6.5 Failure Criteria Failure was claimed when a 20% resistance increase to initial resistance was monitored for five consecutive reading scans. Failure points could not exceed 50 %.
6.6 Identifying Failed Connector(s) and Failure Point(s) Failed connectors or failed points were identified by probing connector and specific test points and daisy chain test points located on the bottom of all test boards. Failure point(s) and number of cycles were recorded, when failure(s) occurred.
6.7 Rerouting with Jumper Wire Once failure and location was detected, rerouting of the effected area was required. Jumper wires (AWG32, 60mm in length, pre-stripped and tinned) provided by Hirose were inserted approximately 2 mm into the appropriate through-holes and then soldered to complete the bypass.
6.8 Test Duration 3500 cycles
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6.9 Test Result See attached document "07-29834-R1 PRINTED CIRCUIT BOARDS TEMPERATURE CYCLE" prepared by Trace Laboratories, Inc. for more details. No failure was observed up to 3,500 temperature cycles.
Board # MB-001 MB-002 MB-003 MB-004 MB-005 MB-006 MB-007 MB-008 MB-009 MB-010 MB-011 MB-012 MB-013 MB-014 MB-015 MB-016
Initial
Resistance
Final
Resistance
Failure cycle & Resistance
Configuration Config-1 Config-1 Config-2 Config-2 Config-3 Config-3 Config-4 Config-4 Config-1 Config-1 Config-2 Config-2 Config-3 Config-3 Config-4 Config-4
Conn-1 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin
Reworked Reworked Reworked Reworked
Conn-2 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin
Conn-3 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin
Reworked Reworked Reworked Reworked
Conn-4 Virgin Virgin Virgin Virgin Virgin Virgin Virgin Virgin
Reworked Reworked Reworked Reworked Reworked Reworked Reworked Reworked
40.9 26.5 40.2 26.0 39.9 25.7 40.2 26.5 41.1 27.5 41.0 26.0 39.8 26.9 40.6 26.4
40.1 25.8 39.7 25.6 39.6 25.2 39.8 26.1 40.1 26.5 40.4 26.6 41.1 27.5 41.5 26.9
No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure No failure
Virgin Virgin Virgin Virgin Unity ohm
Measurement Result
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7 SOLDER BALL SHEAR TEST Ball shear qualification conforms to IPC-9701. The minimum shear force is defined as the mean minus 3 sigma, for a minimum of three connectors
7.1 Measurement Method Force is applied to the edge of the connector so that the balls receive the shearing force. The height of shearing tool should exceed the height of the connector surface of 50m minimum. Test speed: 500 micrometer / second
7.2 Failure Mode The failure mode for the sheared balls is defined as either a bulk solder failure or copper pad lift-off. An intermetallic failure between contacts and balls is unacceptable.
7.3 Test Result See the attachment "TR0636E-20027 : IT3D(M)-300S-BGA (57) BGA shearing force test report"
No intermetallic failure between contacts and balls was observed in both Initial and Post 3500 cycles specimens.
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8. REVISION RECORD
Revision no.
Description (Major changes) Initial release
Date June. 23 , 2008
rd
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